Orion 300
Ultrafast Femtosecond Laser Series for Industrial Processing
- Pulse Duration <400 fs
- Average Power: 120 W – 300 W
- Pulse Energy: 120 µJ – 2000 µJ
- Wavelength: 1030 nm / 515 nm

The Orion series ultrafast femtosecond lasers deliver high‑power, high‑energy pulse outputs and are widely suitable for diverse applications in both scientific research and industrial settings. The 1030 nm model offers two configurations: 200 W at 100 kHz (2 mJ pulse energy) and 300 W at 1 MHz (300 μJ pulse energy), both with a pulse duration of <400 fs. The 515 nm model delivers 120 W at 1 MHz with a pulse energy of 120 μJ and a pulse duration of <350 fs.
All models operate in the high‑quality TEM₀₀ mode (M² ≤ 1.3) with beam circularity exceeding 90%, ensuring excellent beam quality. The beam diameter is approximately 3.0 mm (2.0 mm for the 515 nm model), further enhancing output stability and precision. The laser supports Burst mode with 1 to 10 pulses per burst to meet diverse experimental requirements.
The Orion laser features a compact design with dimensions of 980 × 560 × 153 mm³ and a water‑cooling circulation system to effectively manage thermal load. With a warm‑up time of less than 15 minutes, it operates reliably in environments ranging from 22–30 °C with humidity below 60%.
Supporting PSO/POD/Gate and TTL trigger modes, as well as 0–5 V linear external power control, the Orion series enables high‑precision adjustment and seamless integration with various systems. Combining high power, exceptional stability, and outstanding beam quality, the Orion series is the high‑performance choice in the field of ultrafast lasers.

Glass Drilling
Ultrafast laser drilling of glass employs high-intensity femtosecond or picosecond pulses to create high-aspect-ratio, tapered, or straight-through holes with negligible chipping and micro-cracking. This method is widely used in consumer electronics, medical devices, and optical component manufacturing, where conventional mechanical drilling often fails due to glass brittleness.

Stent Cutting
Stent cutting utilizes femtosecond or picosecond lasers to precisely machine fine strut patterns from thin-walled metal tubes, achieving high precision and virtually zero thermal damage, which is essential for manufacturing cardiovascular and peripheral vascular stents.

Glass Cutting
Ultrafast laser glass cutting uses focused femtosecond pulses to create internal modification lines within transparent glass, enabling controlled separation along predetermined paths with minimal edge chipping and exceptional edge quality. This technology has become indispensable in the production of thin glass displays, MEMS packaging, and optical windows.

Conical Drilling
Conical or tapered drilling with ultrafast lasers refers to the precise fabrication of holes with controlled taper angles and smooth inner walls in hard and brittle materials, typically achieved by adjusting the laser incidence angle, beam focus, or using spiral scanning techniques. It is critical for injection nozzles, optical fiber alignment, and aerospace cooling holes.
Specification | Orion-515-120 | Orion-1030-200 | Orion-1030-300 |
Central Wavelength | 515 ± 3nm | 1030 ± 5nm | |
Output Power | 120W @ 1MHz | 200W @ 100kHz | 300W @ 1MHz |
Repetition Rate | 1Hz - 2MHz | ||
Pulse Energy | 120μJ | 2mJ | 300μJ |
Power Stability | < 1.0%(8 hours,RMS) | ||
Pulse Duration | < 350fs | < 400fs | |
Beam Quality | TEM00,M²≤1.3 | ||
Beam Roundness | > 90% | ||
Beam Diameter | 2.0 ± 0.5mm | 3.0 ± 0.5mm | |
Burst Pulse Number | 1 - 3 | 1 - 10 | |
Dimensions | 980 x 560 x 153mm | ||
Trigger Mode | PSO / POD / Gate mode,and TTL trigger | ||
External Power Control | 0 - 5V,linear control | ||
Warm-up Time | ≤ 15 min | ||
Power Supply | AC100 - 240V / 50 - 60Hz | ||
Operating Humidity | < 60% RH @ 25℃ | ||
Operating Temperature | 22 - 30℃ | ||
Cooling Method | Water circulation cooling | ||
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